A novel, wafer-scale technology for addressing process and cost obstacles associated with underfilling FCOB
- DOI
- 10.1109/ectc.2002.1008125
- Published
- Not recorded
- Container
- 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
- Publisher
- IEEE
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/ectc.2002.1008125,
title = {A novel, wafer-scale technology for addressing process and cost obstacles associated with underfilling FCOB},
author = {R.V. Burress and M.A. Capote and Yong-Joon Lee and H.A. Lenos and J.F. Zamora},
journal = {52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)},
doi = {10.1109/ectc.2002.1008125},
url = {https://doi.org/10.1109/ectc.2002.1008125}
}RIS
TY - JOUR TI - A novel, wafer-scale technology for addressing process and cost obstacles associated with underfilling FCOB AU - R.V. Burress AU - M.A. Capote AU - Yong-Joon Lee AU - H.A. Lenos AU - J.F. Zamora JO - 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) DO - 10.1109/ectc.2002.1008125 UR - https://doi.org/10.1109/ectc.2002.1008125 ER -
APA
Burress, R., Capote, M., Lee, Y., Lenos, H., & Zamora, J. (n.d.). A novel, wafer-scale technology for addressing process and cost obstacles associated with underfilling FCOB. 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345). https://doi.org/10.1109/ectc.2002.1008125
Source records
- crossref · retrieved 2026-09-24T20:41:11.879Z