Electrical Isolation Performance of Microgasket Technology for Implant Packaging

Paritosh Rustogi, Jack W. Judy

Open source

DOI: 10.1109/ectc32862.2020.00251
Published: 2020-06
Container: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
Publisher: IEEE
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1109/ectc32862.2020.00251,
  title = {Electrical Isolation Performance of Microgasket Technology for Implant Packaging},
  author = {Paritosh Rustogi and Jack W. Judy},
  year = {2020},
  journal = {2020 IEEE 70th Electronic Components and Technology Conference (ECTC)},
  doi = {10.1109/ectc32862.2020.00251},
  url = {https://doi.org/10.1109/ectc32862.2020.00251}
}

RIS

TY  - JOUR
TI  - Electrical Isolation Performance of Microgasket Technology for Implant Packaging
AU  - Paritosh Rustogi
AU  - Jack W. Judy
PY  - 2020
JO  - 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
DO  - 10.1109/ectc32862.2020.00251
UR  - https://doi.org/10.1109/ectc32862.2020.00251
ER  -

APA

Rustogi, P., & Judy, J. W. (2020). Electrical Isolation Performance of Microgasket Technology for Implant Packaging. 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc32862.2020.00251

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crossref · retrieved 2026-09-25T06:36:59.914Z