Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections

Romaric Kabre, David Danovitch, Valerie Oberson, Magali Cote

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DOI: 10.1109/ectc51906.2022.00224
Published: 2022-05
Container: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Publisher: IEEE
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1109/ectc51906.2022.00224,
  title = {Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections},
  author = {Romaric Kabre and David Danovitch and Valerie Oberson and Magali Cote},
  year = {2022},
  journal = {2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)},
  doi = {10.1109/ectc51906.2022.00224},
  url = {https://doi.org/10.1109/ectc51906.2022.00224}
}

RIS

TY  - JOUR
TI  - Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections
AU  - Romaric Kabre
AU  - David Danovitch
AU  - Valerie Oberson
AU  - Magali Cote
PY  - 2022
JO  - 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
DO  - 10.1109/ectc51906.2022.00224
UR  - https://doi.org/10.1109/ectc51906.2022.00224
ER  -

APA

Kabre, R., Danovitch, D., Oberson, V., & Cote, M. (2022). Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51906.2022.00224

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crossref · retrieved 2026-09-26T03:18:40.408Z