Microstructure and adhesion strength of copper substrate after oxidation with a newly developed chemical solution
- DOI
- 10.1109/emap.2000.904158
- Published
- Not recorded
- Container
- International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)
- Publisher
- IEEE
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/emap.2000.904158,
title = {Microstructure and adhesion strength of copper substrate after oxidation with a newly developed chemical solution},
author = {Xinyong Fan and E. Chan and J. Yuen and A. Lam and N. Fan and Jingshen Wu and Lutao Weng and N. McLellan},
journal = {International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)},
doi = {10.1109/emap.2000.904158},
url = {https://doi.org/10.1109/emap.2000.904158}
}RIS
TY - JOUR TI - Microstructure and adhesion strength of copper substrate after oxidation with a newly developed chemical solution AU - Xinyong Fan AU - E. Chan AU - J. Yuen AU - A. Lam AU - N. Fan AU - Jingshen Wu AU - Lutao Weng AU - N. McLellan JO - International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) DO - 10.1109/emap.2000.904158 UR - https://doi.org/10.1109/emap.2000.904158 ER -
APA
Fan, X., Chan, E., Yuen, J., Lam, A., Fan, N., Wu, J., Weng, L., & McLellan, N. (n.d.). Microstructure and adhesion strength of copper substrate after oxidation with a newly developed chemical solution. International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458). https://doi.org/10.1109/emap.2000.904158
Source records
- crossref · retrieved 2026-09-27T12:41:41.704Z