Flexible organic TFT bio-signal amplifier using reliable chip component assembly process with conductive adhesive.
- DOI
- 10.1109/embc.2017.8037206
- Published
- 2017 Jul
- Container
- Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference
- Publisher
- Not recorded
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/embc.2017.8037206,
title = {Flexible organic TFT bio-signal amplifier using reliable chip component assembly process with conductive adhesive.},
author = {Yoshimoto S and Uemura T and Akiyama M and Ihara Y and Otake S and Fujii T and Araki T and Sekitani T},
year = {2017},
journal = {Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference},
doi = {10.1109/embc.2017.8037206},
url = {https://doi.org/10.1109/embc.2017.8037206}
}RIS
TY - JOUR TI - Flexible organic TFT bio-signal amplifier using reliable chip component assembly process with conductive adhesive. AU - Yoshimoto S AU - Uemura T AU - Akiyama M AU - Ihara Y AU - Otake S AU - Fujii T AU - Araki T AU - Sekitani T PY - 2017 JO - Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference DO - 10.1109/embc.2017.8037206 UR - https://doi.org/10.1109/embc.2017.8037206 ER -
APA
S, Y., T, U., M, A., Y, I., S, O., T, F., T, A., & T, S. (2017). Flexible organic TFT bio-signal amplifier using reliable chip component assembly process with conductive adhesive.. Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference. https://doi.org/10.1109/embc.2017.8037206
Source records
- pubmed · retrieved 2026-09-25T15:40:45.896Z