Finite element simulation of thermomechanical stress evolution in Cu/low-k interconnects during manufacturing and subsequent thermal cycling
- DOI
- 10.1109/essder.2005.1546692
- Published
- 2005
- Container
- Not recorded
- Publisher
- IEEE
- Open access
- no
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Cite this work
BibTeX
@article{allodium:10.1109/essder.2005.1546692,
title = {Finite element simulation of thermomechanical stress evolution in Cu/low-k interconnects during manufacturing and subsequent thermal cycling},
author = {Nathalie Chérault and Jacques Besson and C. Goldberg and N. Casanova and Marie-Hélène Berger},
year = {2005},
doi = {10.1109/essder.2005.1546692},
url = {https://doi.org/10.1109/essder.2005.1546692}
}RIS
TY - JOUR TI - Finite element simulation of thermomechanical stress evolution in Cu/low-k interconnects during manufacturing and subsequent thermal cycling AU - Nathalie Chérault AU - Jacques Besson AU - C. Goldberg AU - N. Casanova AU - Marie-Hélène Berger PY - 2005 DO - 10.1109/essder.2005.1546692 UR - https://doi.org/10.1109/essder.2005.1546692 ER -
APA
Chérault, N., Besson, J., Goldberg, C., Casanova, N., & Berger, M. (2005). Finite element simulation of thermomechanical stress evolution in Cu/low-k interconnects during manufacturing and subsequent thermal cycling. https://doi.org/10.1109/essder.2005.1546692
Source records
- hal · retrieved 2026-09-26T12:50:21.445Z