Cu pillar based Advanced Packaging, for large area & fine pitch heterogeneous devices
- DOI
- 10.1109/estc48849.2020.9229685
- Published
- 2020-09-15
- Container
- 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
- Publisher
- IEEE
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/estc48849.2020.9229685,
title = {Cu pillar based Advanced Packaging, for large area \& fine pitch heterogeneous devices},
author = {Abdenacer AIT MANI and Nohora CAICEDO and Nadia MILOUD-ALI and Francois LEVY and Frederic BERGER and Thierry MOURIER and Tarik CHAIRA and Natacha R APHOZ and Alexis BEDOIN and Patrick PERAY and Mireille FRANCOU and Alain GUEUGNOT and Laura BOUTAFA and David HENRY},
year = {2020},
journal = {2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)},
doi = {10.1109/estc48849.2020.9229685},
url = {https://doi.org/10.1109/estc48849.2020.9229685}
}RIS
TY - JOUR TI - Cu pillar based Advanced Packaging, for large area & fine pitch heterogeneous devices AU - Abdenacer AIT MANI AU - Nohora CAICEDO AU - Nadia MILOUD-ALI AU - Francois LEVY AU - Frederic BERGER AU - Thierry MOURIER AU - Tarik CHAIRA AU - Natacha R APHOZ AU - Alexis BEDOIN AU - Patrick PERAY AU - Mireille FRANCOU AU - Alain GUEUGNOT AU - Laura BOUTAFA AU - David HENRY PY - 2020 JO - 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) DO - 10.1109/estc48849.2020.9229685 UR - https://doi.org/10.1109/estc48849.2020.9229685 ER -
APA
MANI, A. A., CAICEDO, N., MILOUD-ALI, N., LEVY, F., BERGER, F., MOURIER, T., CHAIRA, T., APHOZ, N. R., BEDOIN, A., PERAY, P., FRANCOU, M., GUEUGNOT, A., BOUTAFA, L., & HENRY, D. (2020). Cu pillar based Advanced Packaging, for large area & fine pitch heterogeneous devices. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). https://doi.org/10.1109/estc48849.2020.9229685
Source records
- crossref · retrieved 2026-09-25T12:23:23.499Z