Effect of Electroplating-Induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes
- DOI
- 10.1109/eurosime69483.2026.11511891
- Published
- 2026-04-19
- Container
- 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Publisher
- IEEE
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/eurosime69483.2026.11511891,
title = {Effect of Electroplating-Induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes},
author = {Marco Sperti and Nicolas Lammens and Mathias Verbeke and Bart Vandevelde and Chinmay Nawghane},
year = {2026},
journal = {2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)},
doi = {10.1109/eurosime69483.2026.11511891},
url = {https://doi.org/10.1109/eurosime69483.2026.11511891}
}RIS
TY - JOUR TI - Effect of Electroplating-Induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes AU - Marco Sperti AU - Nicolas Lammens AU - Mathias Verbeke AU - Bart Vandevelde AU - Chinmay Nawghane PY - 2026 JO - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) DO - 10.1109/eurosime69483.2026.11511891 UR - https://doi.org/10.1109/eurosime69483.2026.11511891 ER -
APA
Sperti, M., Lammens, N., Verbeke, M., Vandevelde, B., & Nawghane, C. (2026). Effect of Electroplating-Induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes. 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime69483.2026.11511891
Source records
- crossref · retrieved 2026-09-26T20:05:50.595Z