Thermal shock simulations of a PCB with embedded components and microvia based interconnection: meso-scale modeling of the woven composite
- DOI
- 10.1109/eurosime69483.2026.11511998
- Published
- 2026-04-19
- Container
- 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Publisher
- IEEE
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/eurosime69483.2026.11511998,
title = {Thermal shock simulations of a PCB with embedded components and microvia based interconnection: meso-scale modeling of the woven composite},
author = {M. Leicht and B. Arati and G. Girard and A. Marie and A. Lagadec and G. Segond and B. Cougo and O. Perrotin and J-P. Fradin and F. Coccetti and S. Mercier},
year = {2026},
journal = {2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)},
doi = {10.1109/eurosime69483.2026.11511998},
url = {https://doi.org/10.1109/eurosime69483.2026.11511998}
}RIS
TY - JOUR TI - Thermal shock simulations of a PCB with embedded components and microvia based interconnection: meso-scale modeling of the woven composite AU - M. Leicht AU - B. Arati AU - G. Girard AU - A. Marie AU - A. Lagadec AU - G. Segond AU - B. Cougo AU - O. Perrotin AU - J-P. Fradin AU - F. Coccetti AU - S. Mercier PY - 2026 JO - 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) DO - 10.1109/eurosime69483.2026.11511998 UR - https://doi.org/10.1109/eurosime69483.2026.11511998 ER -
APA
Leicht, M., Arati, B., Girard, G., Marie, A., Lagadec, A., Segond, G., Cougo, B., Perrotin, O., Fradin, J., Coccetti, F., & Mercier, S. (2026). Thermal shock simulations of a PCB with embedded components and microvia based interconnection: meso-scale modeling of the woven composite. 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime69483.2026.11511998
Source records
- crossref · retrieved 2026-11-09T14:02:01.506Z