Application of JVD nitride gate dielectric to a 0.35 micron CMOS process for reduction of gate leakage current and boron penetration

H.-H. Tseng, P.G.Y. Tsui, P.J. Tobin, J. Mogab, M. Khare, X.W. Wang, T.P. Ma, R. Hegde, C. Hobbs, J. Veteran, M. Hartig, G. Kenig, V. Wang, R. Blumenthal, R. Cotton, V. Kaushik, T. Tamagawa, B.L. Halpern, G.J. Cui, J.J. Schmitt

Open source

DOI
10.1109/iedm.1997.650467
Published
Not recorded
Container
International Electron Devices Meeting. IEDM Technical Digest
Publisher
IEEE
Open access
unknown

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BibTeX

@article{allodium:10.1109/iedm.1997.650467,
  title = {Application of JVD nitride gate dielectric to a 0.35 micron CMOS process for reduction of gate leakage current and boron penetration},
  author = {H.-H. Tseng and P.G.Y. Tsui and P.J. Tobin and J. Mogab and M. Khare and X.W. Wang and T.P. Ma and R. Hegde and C. Hobbs and J. Veteran and M. Hartig and G. Kenig and V. Wang and R. Blumenthal and R. Cotton and V. Kaushik and T. Tamagawa and B.L. Halpern and G.J. Cui and J.J. Schmitt},
  journal = {International Electron Devices Meeting. IEDM Technical Digest},
  doi = {10.1109/iedm.1997.650467},
  url = {https://doi.org/10.1109/iedm.1997.650467}
}

RIS

TY  - JOUR
TI  - Application of JVD nitride gate dielectric to a 0.35 micron CMOS process for reduction of gate leakage current and boron penetration
AU  - H.-H. Tseng
AU  - P.G.Y. Tsui
AU  - P.J. Tobin
AU  - J. Mogab
AU  - M. Khare
AU  - X.W. Wang
AU  - T.P. Ma
AU  - R. Hegde
AU  - C. Hobbs
AU  - J. Veteran
AU  - M. Hartig
AU  - G. Kenig
AU  - V. Wang
AU  - R. Blumenthal
AU  - R. Cotton
AU  - V. Kaushik
AU  - T. Tamagawa
AU  - B.L. Halpern
AU  - G.J. Cui
AU  - J.J. Schmitt
JO  - International Electron Devices Meeting. IEDM Technical Digest
DO  - 10.1109/iedm.1997.650467
UR  - https://doi.org/10.1109/iedm.1997.650467
ER  - 

APA

Tseng, H., Tsui, P., Tobin, P., Mogab, J., Khare, M., Wang, X., Ma, T., Hegde, R., Hobbs, C., Veteran, J., Hartig, M., Kenig, G., Wang, V., Blumenthal, R., Cotton, R., Kaushik, V., Tamagawa, T., Halpern, B., Cui, G., & Schmitt, J. (n.d.). Application of JVD nitride gate dielectric to a 0.35 micron CMOS process for reduction of gate leakage current and boron penetration. International Electron Devices Meeting. IEDM Technical Digest. https://doi.org/10.1109/iedm.1997.650467

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