On the material depletion rate due to electromigration in a copper TSV structure
- DOI
- 10.1109/iirw.2014.7049523
- Published
- 2014-10
- Container
- 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW)
- Publisher
- IEEE
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/iirw.2014.7049523,
title = {On the material depletion rate due to electromigration in a copper TSV structure},
author = {R. L. de Orio and S. Gousseau and S. Moreau and H. Cerice and S. Selberherr and A. Farcy and F. Bay and K. Inal and P. Montmitonnet},
year = {2014},
journal = {2014 IEEE International Integrated Reliability Workshop Final Report (IIRW)},
doi = {10.1109/iirw.2014.7049523},
url = {https://doi.org/10.1109/iirw.2014.7049523}
}RIS
TY - JOUR TI - On the material depletion rate due to electromigration in a copper TSV structure AU - R. L. de Orio AU - S. Gousseau AU - S. Moreau AU - H. Cerice AU - S. Selberherr AU - A. Farcy AU - F. Bay AU - K. Inal AU - P. Montmitonnet PY - 2014 JO - 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW) DO - 10.1109/iirw.2014.7049523 UR - https://doi.org/10.1109/iirw.2014.7049523 ER -
APA
Orio, R. L. D., Gousseau, S., Moreau, S., Cerice, H., Selberherr, S., Farcy, A., Bay, F., Inal, K., & Montmitonnet, P. (2014). On the material depletion rate due to electromigration in a copper TSV structure. 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW). https://doi.org/10.1109/iirw.2014.7049523
Source records
- crossref · retrieved 2026-11-10T13:27:36.442Z