Moisture Influence on Reliability and Electrical Characteristics of SiOC:H Low-k Dielectric Material
- DOI
- 10.1109/iirw47491.2019.8989905
- Published
- 2019-10
- Container
- 2019 IEEE International Integrated Reliability Workshop (IIRW)
- Publisher
- IEEE
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/iirw47491.2019.8989905,
title = {Moisture Influence on Reliability and Electrical Characteristics of SiOC:H Low-k Dielectric Material},
author = {Matthias Vidal-Dho and Quentin Hubert and Patrice Gonon and Bernard Pelissier and Pascal Fornara and Jean-Philippe Escales and Pascale Potard and Jean-Michel Moragues and Jean-Luc Ogier},
year = {2019},
journal = {2019 IEEE International Integrated Reliability Workshop (IIRW)},
doi = {10.1109/iirw47491.2019.8989905},
url = {https://doi.org/10.1109/iirw47491.2019.8989905}
}RIS
TY - JOUR TI - Moisture Influence on Reliability and Electrical Characteristics of SiOC:H Low-k Dielectric Material AU - Matthias Vidal-Dho AU - Quentin Hubert AU - Patrice Gonon AU - Bernard Pelissier AU - Pascal Fornara AU - Jean-Philippe Escales AU - Pascale Potard AU - Jean-Michel Moragues AU - Jean-Luc Ogier PY - 2019 JO - 2019 IEEE International Integrated Reliability Workshop (IIRW) DO - 10.1109/iirw47491.2019.8989905 UR - https://doi.org/10.1109/iirw47491.2019.8989905 ER -
APA
Vidal-Dho, M., Hubert, Q., Gonon, P., Pelissier, B., Fornara, P., Escales, J., Potard, P., Moragues, J., & Ogier, J. (2019). Moisture Influence on Reliability and Electrical Characteristics of SiOC:H Low-k Dielectric Material. 2019 IEEE International Integrated Reliability Workshop (IIRW). https://doi.org/10.1109/iirw47491.2019.8989905
Source records
- crossref · retrieved 2026-11-10T13:55:45.535Z