Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages
- DOI
- 10.1109/isapm.1999.757298
- Published
- Not recorded
- Container
- Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)
- Publisher
- IMAPS - Int. Microelectron. & Packaging Soc
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/isapm.1999.757298,
title = {Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages},
author = {M.A. Occhionero and R.A. Hay and R.W. Adams and K.P. Fennessy},
journal = {Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405)},
doi = {10.1109/isapm.1999.757298},
url = {https://doi.org/10.1109/isapm.1999.757298}
}RIS
TY - JOUR TI - Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages AU - M.A. Occhionero AU - R.A. Hay AU - R.W. Adams AU - K.P. Fennessy JO - Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405) DO - 10.1109/isapm.1999.757298 UR - https://doi.org/10.1109/isapm.1999.757298 ER -
APA
Occhionero, M., Hay, R., Adams, R., & Fennessy, K. (n.d.). Cost-effective manufacturing of aluminium silicon carbide (AlSiC) electronic packages. Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405). https://doi.org/10.1109/isapm.1999.757298
Source records
- crossref · retrieved 2026-09-25T14:37:57.835Z