Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging
- DOI
- 10.1109/jeds.2022.3142769
- Published
- 2022
- Container
- IEEE Journal of the Electron Devices Society
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/jeds.2022.3142769,
title = {Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging},
author = {Xiao Hou and Sujie Chen and Wei Tang and Jianghu Liang and Bang Ouyang and Ming Li and Yawen Song and Tong Shan and Chun-Chao Chen and Patrick Too and Xiaoqing Wei and Libo Jin and Gang Qi and Xiaojun Guo},
year = {2022},
journal = {IEEE Journal of the Electron Devices Society},
doi = {10.1109/jeds.2022.3142769},
url = {https://doi.org/10.1109/jeds.2022.3142769}
}RIS
TY - JOUR TI - Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging AU - Xiao Hou AU - Sujie Chen AU - Wei Tang AU - Jianghu Liang AU - Bang Ouyang AU - Ming Li AU - Yawen Song AU - Tong Shan AU - Chun-Chao Chen AU - Patrick Too AU - Xiaoqing Wei AU - Libo Jin AU - Gang Qi AU - Xiaojun Guo PY - 2022 JO - IEEE Journal of the Electron Devices Society DO - 10.1109/jeds.2022.3142769 UR - https://doi.org/10.1109/jeds.2022.3142769 ER -
APA
Hou, X., Chen, S., Tang, W., Liang, J., Ouyang, B., Li, M., Song, Y., Shan, T., Chen, C., Too, P., Wei, X., Jin, L., Qi, G., & Guo, X. (2022). Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging. IEEE Journal of the Electron Devices Society. https://doi.org/10.1109/jeds.2022.3142769
Source records
- crossref · retrieved 2026-09-26T08:15:43.077Z