E-Link: A 256-ch Mini-Pedestal Connector for High-Density Soft Neural Interfaces.

Bai T, Li G, Qi Y, Fang H

DOI: 10.1109/jflex.2026.3692102
Published: 2026 May 11
Container: IEEE journal on flexible electronics
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1109/jflex.2026.3692102,
  title = {E-Link: A 256-ch Mini-Pedestal Connector for High-Density Soft Neural Interfaces.},
  author = {Bai T and Li G and Qi Y and Fang H},
  year = {2026},
  journal = {IEEE journal on flexible electronics},
  doi = {10.1109/jflex.2026.3692102},
  url = {https://doi.org/10.1109/jflex.2026.3692102}
}

RIS

TY  - JOUR
TI  - E-Link: A 256-ch Mini-Pedestal Connector for High-Density Soft Neural Interfaces.
AU  - Bai T
AU  - Li G
AU  - Qi Y
AU  - Fang H
PY  - 2026
JO  - IEEE journal on flexible electronics
DO  - 10.1109/jflex.2026.3692102
UR  - https://doi.org/10.1109/jflex.2026.3692102
ER  -

APA

T, B., G, L., Y, Q., & H, F. (2026). E-Link: A 256-ch Mini-Pedestal Connector for High-Density Soft Neural Interfaces.. IEEE journal on flexible electronics. https://doi.org/10.1109/jflex.2026.3692102

Source records

pubmed · retrieved 2026-09-25T05:19:48.188Z