Inline Plating of Ni/Cu Contacts for Industrial TOPCon Si Solar Cells—Status and Outlook
- DOI
- 10.1109/jphotov.2026.3663685
- Published
- 2026-05
- Container
- IEEE Journal of Photovoltaics
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/jphotov.2026.3663685,
title = {Inline Plating of Ni/Cu Contacts for Industrial TOPCon Si Solar Cells—Status and Outlook},
author = {Jonas Eckert and Sven Kluska and René Haberstroh and Christian Schmiga and Sebastian Mack and Mathias Kamp and Damian Brunner and Jan Nekarda and Florian Clement},
year = {2026},
journal = {IEEE Journal of Photovoltaics},
doi = {10.1109/jphotov.2026.3663685},
url = {https://doi.org/10.1109/jphotov.2026.3663685}
}RIS
TY - JOUR TI - Inline Plating of Ni/Cu Contacts for Industrial TOPCon Si Solar Cells—Status and Outlook AU - Jonas Eckert AU - Sven Kluska AU - René Haberstroh AU - Christian Schmiga AU - Sebastian Mack AU - Mathias Kamp AU - Damian Brunner AU - Jan Nekarda AU - Florian Clement PY - 2026 JO - IEEE Journal of Photovoltaics DO - 10.1109/jphotov.2026.3663685 UR - https://doi.org/10.1109/jphotov.2026.3663685 ER -
APA
Eckert, J., Kluska, S., Haberstroh, R., Schmiga, C., Mack, S., Kamp, M., Brunner, D., Nekarda, J., & Clement, F. (2026). Inline Plating of Ni/Cu Contacts for Industrial TOPCon Si Solar Cells—Status and Outlook. IEEE Journal of Photovoltaics. https://doi.org/10.1109/jphotov.2026.3663685
Source records
- crossref · retrieved 2026-11-03T22:08:03.502Z