Study of carbon nanotube flip-chip methodology for interconnect technology bia electromagnetic and circuit model approach
- DOI
- 10.1109/mwsym.2011.5972784
- Published
- 2011
- Container
- Not recorded
- Publisher
- Not recorded
- Open access
- no
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Cite this work
BibTeX
@article{allodium:10.1109/mwsym.2011.5972784,
title = {Study of carbon nanotube flip-chip methodology for interconnect technology bia electromagnetic and circuit model approach},
author = {Christophe Brun and Chin Chong Yap and Dunlin Tan and Edwin Hang Tong Teo and Stéphane Bila and Serge Verdeyme and Dominique Baillargeat and Beng Kang Tay},
year = {2011},
doi = {10.1109/mwsym.2011.5972784},
url = {https://doi.org/10.1109/mwsym.2011.5972784}
}RIS
TY - JOUR TI - Study of carbon nanotube flip-chip methodology for interconnect technology bia electromagnetic and circuit model approach AU - Christophe Brun AU - Chin Chong Yap AU - Dunlin Tan AU - Edwin Hang Tong Teo AU - Stéphane Bila AU - Serge Verdeyme AU - Dominique Baillargeat AU - Beng Kang Tay PY - 2011 DO - 10.1109/mwsym.2011.5972784 UR - https://doi.org/10.1109/mwsym.2011.5972784 ER -
APA
Brun, C., Yap, C. C., Tan, D., Teo, E. H. T., Bila, S., Verdeyme, S., Baillargeat, D., & Tay, B. K. (2011). Study of carbon nanotube flip-chip methodology for interconnect technology bia electromagnetic and circuit model approach. https://doi.org/10.1109/mwsym.2011.5972784
Source records
- hal · retrieved 2026-09-26T23:47:30.310Z