A Cauer-Foster Integrated Thermal Network Model for Multi-Chip SiC Power Modules Considering Temperature-Dependent Material Properties
- DOI
- 10.1109/ojpel.2026.3699397
- Published
- 2026
- Container
- IEEE Open Journal of Power Electronics
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.1109/ojpel.2026.3699397,
title = {A Cauer-Foster Integrated Thermal Network Model for Multi-Chip SiC Power Modules Considering Temperature-Dependent Material Properties},
author = {Shuoyu Ye and Jingyang Hu and Guofu Chen and Chushan Li and Haoze Luo and Wuhua Li and Xiangning He and Francesco Iannuzzo},
year = {2026},
journal = {IEEE Open Journal of Power Electronics},
doi = {10.1109/ojpel.2026.3699397},
url = {https://doi.org/10.1109/ojpel.2026.3699397}
}RIS
TY - JOUR TI - A Cauer-Foster Integrated Thermal Network Model for Multi-Chip SiC Power Modules Considering Temperature-Dependent Material Properties AU - Shuoyu Ye AU - Jingyang Hu AU - Guofu Chen AU - Chushan Li AU - Haoze Luo AU - Wuhua Li AU - Xiangning He AU - Francesco Iannuzzo PY - 2026 JO - IEEE Open Journal of Power Electronics DO - 10.1109/ojpel.2026.3699397 UR - https://doi.org/10.1109/ojpel.2026.3699397 ER -
APA
Ye, S., Hu, J., Chen, G., Li, C., Luo, H., Li, W., He, X., & Iannuzzo, F. (2026). A Cauer-Foster Integrated Thermal Network Model for Multi-Chip SiC Power Modules Considering Temperature-Dependent Material Properties. IEEE Open Journal of Power Electronics. https://doi.org/10.1109/ojpel.2026.3699397
Source records
- doaj · retrieved 2026-09-25T23:22:55.069Z