Passive Thermal Compensation of Silicon Resonators Through Modal Engineering

Amirmohammad Zare, Azadeh Jafari, Abid Ali, Ashudeep, Behraad Bahreyni

Open source

DOI: 10.1109/ojuffc.2026.3681525
Published: 2026
Container: IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1109/ojuffc.2026.3681525,
  title = {Passive Thermal Compensation of Silicon Resonators Through Modal Engineering},
  author = {Amirmohammad Zare and Azadeh Jafari and Abid Ali and Ashudeep and Behraad Bahreyni},
  year = {2026},
  journal = {IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control},
  doi = {10.1109/ojuffc.2026.3681525},
  url = {https://doi.org/10.1109/ojuffc.2026.3681525}
}

RIS

TY  - JOUR
TI  - Passive Thermal Compensation of Silicon Resonators Through Modal Engineering
AU  - Amirmohammad Zare
AU  - Azadeh Jafari
AU  - Abid Ali
AU  - Ashudeep
AU  - Behraad Bahreyni
PY  - 2026
JO  - IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control
DO  - 10.1109/ojuffc.2026.3681525
UR  - https://doi.org/10.1109/ojuffc.2026.3681525
ER  -

APA

Zare, A., Jafari, A., Ali, A., Ashudeep, & Bahreyni, B. (2026). Passive Thermal Compensation of Silicon Resonators Through Modal Engineering. IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control. https://doi.org/10.1109/ojuffc.2026.3681525

Source records

crossref · retrieved 2026-11-10T15:50:31.580Z