Artifact: Co-zyBench: A Thermal Comfort Provision Benchmark for Smart Buildings
- DOI
- 10.1109/percomworkshops59983.2024.10502756
- Published
- 2024-03-11
- Container
- 2024 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops)
- Publisher
- IEEE
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/percomworkshops59983.2024.10502756,
title = {Artifact: Co-zyBench: A Thermal Comfort Provision Benchmark for Smart Buildings},
author = {Jun Ma and Dimitrije Panic and Roberto Yus and Georgios Bouloukakis},
year = {2024},
journal = {2024 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops)},
doi = {10.1109/percomworkshops59983.2024.10502756},
url = {https://doi.org/10.1109/percomworkshops59983.2024.10502756}
}RIS
TY - JOUR TI - Artifact: Co-zyBench: A Thermal Comfort Provision Benchmark for Smart Buildings AU - Jun Ma AU - Dimitrije Panic AU - Roberto Yus AU - Georgios Bouloukakis PY - 2024 JO - 2024 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops) DO - 10.1109/percomworkshops59983.2024.10502756 UR - https://doi.org/10.1109/percomworkshops59983.2024.10502756 ER -
APA
Ma, J., Panic, D., Yus, R., & Bouloukakis, G. (2024). Artifact: Co-zyBench: A Thermal Comfort Provision Benchmark for Smart Buildings. 2024 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops). https://doi.org/10.1109/percomworkshops59983.2024.10502756
Source records
- crossref · retrieved 2026-09-26T12:28:14.250Z