A High-Power SOI-CMOS PA Module with Fan-Out Wafer-Level Packaging for 2.4 GHz Wi-Fi 6 Applications
- DOI
- 10.1109/rfic51843.2021.9490483
- Published
- 2021-06-07
- Container
- 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)
- Publisher
- IEEE
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/rfic51843.2021.9490483,
title = {A High-Power SOI-CMOS PA Module with Fan-Out Wafer-Level Packaging for 2.4 GHz Wi-Fi 6 Applications},
author = {P. Reynier and A. Serhan and D. Parat and R. Mourot and M. Gaye and P. Kauv and A. Cardoso and A. Gouvea and S. Nogueira and A. Giry},
year = {2021},
journal = {2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)},
doi = {10.1109/rfic51843.2021.9490483},
url = {https://doi.org/10.1109/rfic51843.2021.9490483}
}RIS
TY - JOUR TI - A High-Power SOI-CMOS PA Module with Fan-Out Wafer-Level Packaging for 2.4 GHz Wi-Fi 6 Applications AU - P. Reynier AU - A. Serhan AU - D. Parat AU - R. Mourot AU - M. Gaye AU - P. Kauv AU - A. Cardoso AU - A. Gouvea AU - S. Nogueira AU - A. Giry PY - 2021 JO - 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) DO - 10.1109/rfic51843.2021.9490483 UR - https://doi.org/10.1109/rfic51843.2021.9490483 ER -
APA
Reynier, P., Serhan, A., Parat, D., Mourot, R., Gaye, M., Kauv, P., Cardoso, A., Gouvea, A., Nogueira, S., & Giry, A. (2021). A High-Power SOI-CMOS PA Module with Fan-Out Wafer-Level Packaging for 2.4 GHz Wi-Fi 6 Applications. 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC). https://doi.org/10.1109/rfic51843.2021.9490483
Source records
- crossref · retrieved 2026-09-27T01:35:01.550Z