Advanced multichip module packaging of microelectromechanical systems
- DOI
- 10.1109/sensor.1997.613633
- Published
- Not recorded
- Container
- Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97)
- Publisher
- IEEE
- Open access
- unknown
Credibility signals
uncertain Score 58/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
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Cite this work
BibTeX
@article{allodium:10.1109/sensor.1997.613633,
title = {Advanced multichip module packaging of microelectromechanical systems},
author = {J.T. Butler and V.M. Bright and J.H. Comtois},
journal = {Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97)},
doi = {10.1109/sensor.1997.613633},
url = {https://doi.org/10.1109/sensor.1997.613633}
}RIS
TY - JOUR TI - Advanced multichip module packaging of microelectromechanical systems AU - J.T. Butler AU - V.M. Bright AU - J.H. Comtois JO - Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97) DO - 10.1109/sensor.1997.613633 UR - https://doi.org/10.1109/sensor.1997.613633 ER -
APA
Butler, J., Bright, V., & Comtois, J. (n.d.). Advanced multichip module packaging of microelectromechanical systems. Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97). https://doi.org/10.1109/sensor.1997.613633
Source records
- crossref · retrieved 2026-09-24T18:29:11.050Z