Design and use of heat spreaders to cool low to moderate power plastic packages
- DOI
- 10.1109/stherm.1998.660388
- Published
- Not recorded
- Container
- Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195)
- Publisher
- IEEE
- Open access
- unknown
Credibility signals
uncertain Score 58/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
Show all credibility signals
- supportingDOI registered: A matching record was returned by Crossref.
- supportingDOI resolves: A matching record was returned by Crossref.
- not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility.
- not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made.
- not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made.
- not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made.
- not scoredROR affiliation: Not checked or no result supplied; no credibility inference made.
- not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredOpen access status: Not checked or no result supplied; no credibility inference made.
- not scoredPublication license: Not checked or no result supplied; no credibility inference made.
- not scoredPublication version: A publication version was supplied but is not scored.
- cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty.
Cite this work
BibTeX
@article{allodium:10.1109/stherm.1998.660388,
title = {Design and use of heat spreaders to cool low to moderate power plastic packages},
author = {K. Zhang and M. De Sorgo},
journal = {Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195)},
doi = {10.1109/stherm.1998.660388},
url = {https://doi.org/10.1109/stherm.1998.660388}
}RIS
TY - JOUR TI - Design and use of heat spreaders to cool low to moderate power plastic packages AU - K. Zhang AU - M. De Sorgo JO - Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195) DO - 10.1109/stherm.1998.660388 UR - https://doi.org/10.1109/stherm.1998.660388 ER -
APA
Zhang, K., & Sorgo, M. D. (n.d.). Design and use of heat spreaders to cool low to moderate power plastic packages. Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195). https://doi.org/10.1109/stherm.1998.660388
Source records
- crossref · retrieved 2026-09-26T13:48:32.418Z