Real-Time Computation of Thermal Constraints in Multichip Power Electronic Devices
- DOI
- 10.1109/tcapt.2004.828563
- Published
- 2004-06
- Container
- IEEE Transactions on Components and Packaging Technologies
- Publisher
- Not recorded
- Open access
- no
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Cite this work
BibTeX
@article{allodium:10.1109/tcapt.2004.828563,
title = {Real-Time Computation of Thermal Constraints in Multichip Power Electronic Devices},
author = {Zoubir Khatir and S. Carubelli and F. Lecoq},
year = {2004},
journal = {IEEE Transactions on Components and Packaging Technologies},
doi = {10.1109/tcapt.2004.828563},
url = {https://doi.org/10.1109/tcapt.2004.828563}
}RIS
TY - JOUR TI - Real-Time Computation of Thermal Constraints in Multichip Power Electronic Devices AU - Zoubir Khatir AU - S. Carubelli AU - F. Lecoq PY - 2004 JO - IEEE Transactions on Components and Packaging Technologies DO - 10.1109/tcapt.2004.828563 UR - https://doi.org/10.1109/tcapt.2004.828563 ER -
APA
Khatir, Z., Carubelli, S., & Lecoq, F. (2004). Real-Time Computation of Thermal Constraints in Multichip Power Electronic Devices. IEEE Transactions on Components and Packaging Technologies. https://doi.org/10.1109/tcapt.2004.828563
Source records
- hal · retrieved 2026-09-26T05:57:34.943Z