Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies.

Park J, Xu J, Engler A, Williamson J, Mathew V, Park S, Flake J.

DOI: 10.1109/tcpmt.2024.3399662
Published: 2024-05-09
Container: IEEE Trans Compon Packaging Manuf Technol
Publisher: Not recorded
Open access: no

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Cite this work

BibTeX

@article{allodium:10.1109/tcpmt.2024.3399662,
  title = {Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies.},
  author = {Park J and  Xu J and  Engler A and  Williamson J and  Mathew V and  Park S and  Flake J.},
  year = {2024},
  journal = {IEEE Trans Compon Packaging Manuf Technol},
  doi = {10.1109/tcpmt.2024.3399662},
  url = {https://doi.org/10.1109/tcpmt.2024.3399662}
}

RIS

TY  - JOUR
TI  - Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies.
AU  - Park J
AU  -  Xu J
AU  -  Engler A
AU  -  Williamson J
AU  -  Mathew V
AU  -  Park S
AU  -  Flake J.
PY  - 2024
JO  - IEEE Trans Compon Packaging Manuf Technol
DO  - 10.1109/tcpmt.2024.3399662
UR  - https://doi.org/10.1109/tcpmt.2024.3399662
ER  -

APA

J, P., J, X., A, E., J, W., V, M., S, P., & J., F. (2024). Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies.. IEEE Trans Compon Packaging Manuf Technol. https://doi.org/10.1109/tcpmt.2024.3399662

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europe-pmc · retrieved 2026-09-26T10:12:45.075Z