Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies.

Park J, Xu J, Engler A, Williamson J, Mathew V, Park S, Flake J

DOI: 10.1109/tcpmt.2024.3399662
Published: 2024 Jun
Container: IEEE transactions on components, packaging, and manufacturing technology
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1109/tcpmt.2024.3399662,
  title = {Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies.},
  author = {Park J and Xu J and Engler A and Williamson J and Mathew V and Park S and Flake J},
  year = {2024},
  journal = {IEEE transactions on components, packaging, and manufacturing technology},
  doi = {10.1109/tcpmt.2024.3399662},
  url = {https://doi.org/10.1109/tcpmt.2024.3399662}
}

RIS

TY  - JOUR
TI  - Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies.
AU  - Park J
AU  - Xu J
AU  - Engler A
AU  - Williamson J
AU  - Mathew V
AU  - Park S
AU  - Flake J
PY  - 2024
JO  - IEEE transactions on components, packaging, and manufacturing technology
DO  - 10.1109/tcpmt.2024.3399662
UR  - https://doi.org/10.1109/tcpmt.2024.3399662
ER  -

APA

J, P., J, X., A, E., J, W., V, M., S, P., & J, F. (2024). Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies.. IEEE transactions on components, packaging, and manufacturing technology. https://doi.org/10.1109/tcpmt.2024.3399662

Source records

pubmed · retrieved 2026-11-10T14:19:58.405Z