The role of plasmalemmal-cortical anchoring on the stability of transmembrane electropores

S. Kennedy, Z. Ji, N. Rockweiler, A. Hahn, J. Booske, S. Hagness

Open source

DOI
10.1109/tdei.2009.5293935
Published
2009-10
Container
IEEE Transactions on Dielectrics and Electrical Insulation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Open access
unknown

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BibTeX

@article{allodium:10.1109/tdei.2009.5293935,
  title = {The role of plasmalemmal-cortical anchoring on the stability of transmembrane electropores},
  author = {S. Kennedy and Z. Ji and N. Rockweiler and A. Hahn and J. Booske and S. Hagness},
  year = {2009},
  journal = {IEEE Transactions on Dielectrics and Electrical Insulation},
  doi = {10.1109/tdei.2009.5293935},
  url = {https://doi.org/10.1109/tdei.2009.5293935}
}

RIS

TY  - JOUR
TI  - The role of plasmalemmal-cortical anchoring on the stability of transmembrane electropores
AU  - S. Kennedy
AU  - Z. Ji
AU  - N. Rockweiler
AU  - A. Hahn
AU  - J. Booske
AU  - S. Hagness
PY  - 2009
JO  - IEEE Transactions on Dielectrics and Electrical Insulation
DO  - 10.1109/tdei.2009.5293935
UR  - https://doi.org/10.1109/tdei.2009.5293935
ER  - 

APA

Kennedy, S., Ji, Z., Rockweiler, N., Hahn, A., Booske, J., & Hagness, S. (2009). The role of plasmalemmal-cortical anchoring on the stability of transmembrane electropores. IEEE Transactions on Dielectrics and Electrical Insulation. https://doi.org/10.1109/tdei.2009.5293935

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