Notice of Retraction: Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures

Stefano Piersanti, Francesco de Paulis, Carlo Olivieri, Daniel H. Jung, Joungho Kim, Antonio Orlandi

DOI: 10.1109/temc.2017.2685348
Published: 2017-10
Container: IEEE Transactions on Electromagnetic Compatibility
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Open access: unknown

Credibility signals

serious concern Score 29/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

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serious concernRetraction Watch retraction: 1 retraction notice matched this DOI. Source: Retraction Watch; license: CC BY 4.0
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Cite this work

BibTeX

@article{allodium:10.1109/temc.2017.2685348,
  title = {Notice of Retraction: Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures},
  author = {Stefano Piersanti and Francesco de Paulis and Carlo Olivieri and Daniel H. Jung and Joungho Kim and Antonio Orlandi},
  year = {2017},
  journal = {IEEE Transactions on Electromagnetic Compatibility},
  doi = {10.1109/temc.2017.2685348},
  url = {https://doi.org/10.1109/temc.2017.2685348}
}

RIS

TY  - JOUR
TI  - Notice of Retraction: Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures
AU  - Stefano Piersanti
AU  - Francesco de Paulis
AU  - Carlo Olivieri
AU  - Daniel H. Jung
AU  - Joungho Kim
AU  - Antonio Orlandi
PY  - 2017
JO  - IEEE Transactions on Electromagnetic Compatibility
DO  - 10.1109/temc.2017.2685348
UR  - https://doi.org/10.1109/temc.2017.2685348
ER  -

APA

Piersanti, S., Paulis, F. D., Olivieri, C., Jung, D. H., Kim, J., & Orlandi, A. (2017). Notice of Retraction: Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures. IEEE Transactions on Electromagnetic Compatibility. https://doi.org/10.1109/temc.2017.2685348

Source records

crossref · retrieved 2026-09-25T13:37:20.473Z