Notice of Retraction: A Method of Extracting the Effective Copper Surface Roughness of a PCB Laminate In Situ

Jason J. Ellison, Sedig S. Agili

DOI: 10.1109/temc.2018.2798290
Published: 2018-08
Container: IEEE Transactions on Electromagnetic Compatibility
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Open access: unknown

Credibility signals

serious concern Score 29/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

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supportingDOI registered: A matching record was returned by Crossref. Source: Crossref; license: CC0 metadata
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serious concernRetraction Watch retraction: 1 retraction notice matched this DOI. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
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supportingMetadata completeness: All 6 scored descriptive metadata groups are present. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer

Cite this work

BibTeX

@article{allodium:10.1109/temc.2018.2798290,
  title = {Notice of Retraction: A Method of Extracting the Effective Copper Surface Roughness of a PCB Laminate In Situ},
  author = {Jason J. Ellison and Sedig S. Agili},
  year = {2018},
  journal = {IEEE Transactions on Electromagnetic Compatibility},
  doi = {10.1109/temc.2018.2798290},
  url = {https://doi.org/10.1109/temc.2018.2798290}
}

RIS

TY  - JOUR
TI  - Notice of Retraction: A Method of Extracting the Effective Copper Surface Roughness of a PCB Laminate In Situ
AU  - Jason J. Ellison
AU  - Sedig S. Agili
PY  - 2018
JO  - IEEE Transactions on Electromagnetic Compatibility
DO  - 10.1109/temc.2018.2798290
UR  - https://doi.org/10.1109/temc.2018.2798290
ER  -

APA

Ellison, J. J., & Agili, S. S. (2018). Notice of Retraction: A Method of Extracting the Effective Copper Surface Roughness of a PCB Laminate In Situ. IEEE Transactions on Electromagnetic Compatibility. https://doi.org/10.1109/temc.2018.2798290

Source records

crossref · retrieved 2026-11-06T14:27:48.040Z