Notice of Retraction: Signal and Power Integrity SPICE Cosimulation Versus 3-D EM Co-Extraction for DDR Memory Interface Modules
- DOI
- 10.1109/temc.2018.2817259
- Published
- 2026
- Container
- IEEE Transactions on Electromagnetic Compatibility
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Open access
- unknown
Credibility signals
serious concern Score 29/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
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- serious concernRetraction Watch retraction: 1 retraction notice matched this DOI.
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- not scoredPublication version: A publication version was supplied but is not scored.
- supportingMetadata completeness: All 6 scored descriptive metadata groups are present.
Cite this work
BibTeX
@article{allodium:10.1109/temc.2018.2817259,
title = {Notice of Retraction: Signal and Power Integrity SPICE Cosimulation Versus 3-D EM Co-Extraction for DDR Memory Interface Modules},
author = {Lian Kheng Teoh and Nitin Srivastava and Hwanwoo Shim and Chung Boon-Kuan and Antonio Ciccomancini Scogna},
year = {2026},
journal = {IEEE Transactions on Electromagnetic Compatibility},
doi = {10.1109/temc.2018.2817259},
url = {https://doi.org/10.1109/temc.2018.2817259}
}RIS
TY - JOUR TI - Notice of Retraction: Signal and Power Integrity SPICE Cosimulation Versus 3-D EM Co-Extraction for DDR Memory Interface Modules AU - Lian Kheng Teoh AU - Nitin Srivastava AU - Hwanwoo Shim AU - Chung Boon-Kuan AU - Antonio Ciccomancini Scogna PY - 2026 JO - IEEE Transactions on Electromagnetic Compatibility DO - 10.1109/temc.2018.2817259 UR - https://doi.org/10.1109/temc.2018.2817259 ER -
APA
Teoh, L. K., Srivastava, N., Shim, H., Boon-Kuan, C., & Scogna, A. C. (2026). Notice of Retraction: Signal and Power Integrity SPICE Cosimulation Versus 3-D EM Co-Extraction for DDR Memory Interface Modules. IEEE Transactions on Electromagnetic Compatibility. https://doi.org/10.1109/temc.2018.2817259
Source records
- crossref · retrieved 2026-11-10T16:34:36.060Z