Study of Full-View Finger Vein Biometrics on Redundancy-compensated 3D Reconstruction and Frequency-Spatial Coupling Feature Extraction.

Huang J, Luo D, Unnervik A, Yang W, Tistarelli M, Kang W

Open source

DOI
10.1109/tpami.2026.3711850
Published
2026 Jul 9
Container
IEEE transactions on pattern analysis and machine intelligence
Publisher
Not recorded
Open access
no

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BibTeX

@article{allodium:10.1109/tpami.2026.3711850,
  title = {Study of Full-View Finger Vein Biometrics on Redundancy-compensated 3D Reconstruction and Frequency-Spatial Coupling Feature Extraction.},
  author = {Huang J and Luo D and Unnervik A and Yang W and Tistarelli M and Kang W},
  year = {2026},
  journal = {IEEE transactions on pattern analysis and machine intelligence},
  doi = {10.1109/tpami.2026.3711850},
  url = {https://doi.org/10.1109/tpami.2026.3711850}
}

RIS

TY  - JOUR
TI  - Study of Full-View Finger Vein Biometrics on Redundancy-compensated 3D Reconstruction and Frequency-Spatial Coupling Feature Extraction.
AU  - Huang J
AU  - Luo D
AU  - Unnervik A
AU  - Yang W
AU  - Tistarelli M
AU  - Kang W
PY  - 2026
JO  - IEEE transactions on pattern analysis and machine intelligence
DO  - 10.1109/tpami.2026.3711850
UR  - https://doi.org/10.1109/tpami.2026.3711850
ER  - 

APA

J, H., D, L., A, U., W, Y., M, T., & W, K. (2026). Study of Full-View Finger Vein Biometrics on Redundancy-compensated 3D Reconstruction and Frequency-Spatial Coupling Feature Extraction.. IEEE transactions on pattern analysis and machine intelligence. https://doi.org/10.1109/tpami.2026.3711850

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