Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging
- DOI
- 10.1109/tpel.2006.882974
- Published
- 2006-11
- Container
- IEEE Transactions on Power Electronics
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1109/tpel.2006.882974,
title = {Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging},
author = {Mariya Ivanova and Yvan Avenas and Christian Schaeffer and Jean-Bernard Dezord and Juergen Schulz-Harder},
year = {2006},
journal = {IEEE Transactions on Power Electronics},
doi = {10.1109/tpel.2006.882974},
url = {https://doi.org/10.1109/tpel.2006.882974}
}RIS
TY - JOUR TI - Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging AU - Mariya Ivanova AU - Yvan Avenas AU - Christian Schaeffer AU - Jean-Bernard Dezord AU - Juergen Schulz-Harder PY - 2006 JO - IEEE Transactions on Power Electronics DO - 10.1109/tpel.2006.882974 UR - https://doi.org/10.1109/tpel.2006.882974 ER -
APA
Ivanova, M., Avenas, Y., Schaeffer, C., Dezord, J., & Schulz-Harder, J. (2006). Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging. IEEE Transactions on Power Electronics. https://doi.org/10.1109/tpel.2006.882974
Source records
- crossref · retrieved 2026-09-26T02:07:33.631Z