Review of Power Electronics Components at Cryogenic Temperatures.
- DOI
- 10.1109/tpel.2019.2944781
- Published
- 2020 May
- Container
- IEEE transactions on power electronics
- Publisher
- Not recorded
- Open access
- yes
Credibility signals
limited evidence Score 45/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
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Cite this work
BibTeX
@article{allodium:10.1109/tpel.2019.2944781,
title = {Review of Power Electronics Components at Cryogenic Temperatures.},
author = {Gui H and Chen R and Niu J and Zhang Z and Tolbert LM and Wang FF and Blalock BJ and Costinett D and Choi BB},
year = {2020},
journal = {IEEE transactions on power electronics},
doi = {10.1109/tpel.2019.2944781},
url = {https://doi.org/10.1109/tpel.2019.2944781}
}RIS
TY - JOUR TI - Review of Power Electronics Components at Cryogenic Temperatures. AU - Gui H AU - Chen R AU - Niu J AU - Zhang Z AU - Tolbert LM AU - Wang FF AU - Blalock BJ AU - Costinett D AU - Choi BB PY - 2020 JO - IEEE transactions on power electronics DO - 10.1109/tpel.2019.2944781 UR - https://doi.org/10.1109/tpel.2019.2944781 ER -
APA
H, G., R, C., J, N., Z, Z., LM, T., FF, W., BJ, B., D, C., & BB, C. (2020). Review of Power Electronics Components at Cryogenic Temperatures.. IEEE transactions on power electronics. https://doi.org/10.1109/tpel.2019.2944781
Source records
- pubmed · retrieved 2026-11-10T15:05:22.725Z