A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability.

Sood B, Shue J, Leitner J, Daniluk K, Sindjui LN

DOI: 10.1109/tr.2018.2835140
Published: 2019 Mar
Container: IEEE transactions on reliability
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1109/tr.2018.2835140,
  title = {A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability.},
  author = {Sood B and Shue J and Leitner J and Daniluk K and Sindjui LN},
  year = {2019},
  journal = {IEEE transactions on reliability},
  doi = {10.1109/tr.2018.2835140},
  url = {https://doi.org/10.1109/tr.2018.2835140}
}

RIS

TY  - JOUR
TI  - A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability.
AU  - Sood B
AU  - Shue J
AU  - Leitner J
AU  - Daniluk K
AU  - Sindjui LN
PY  - 2019
JO  - IEEE transactions on reliability
DO  - 10.1109/tr.2018.2835140
UR  - https://doi.org/10.1109/tr.2018.2835140
ER  -

APA

B, S., J, S., J, L., K, D., & LN, S. (2019). A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability.. IEEE transactions on reliability. https://doi.org/10.1109/tr.2018.2835140

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pubmed · retrieved 2026-11-10T15:49:12.940Z