The Rheology Gap: A Component-Level Benchmark for VR-to-Reality Motor Skill Transfer under Linear Haptic Simulation

Zhiping Liu, Lu An

Open source

DOI
10.1109/tvcg.2026.3745621
Published
2026
Container
IEEE Transactions on Visualization and Computer Graphics
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Open access
unknown

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BibTeX

@article{allodium:10.1109/tvcg.2026.3745621,
  title = {The Rheology Gap: A Component-Level Benchmark for VR-to-Reality Motor Skill Transfer under Linear Haptic Simulation},
  author = {Zhiping Liu and Lu An},
  year = {2026},
  journal = {IEEE Transactions on Visualization and Computer Graphics},
  doi = {10.1109/tvcg.2026.3745621},
  url = {https://doi.org/10.1109/tvcg.2026.3745621}
}

RIS

TY  - JOUR
TI  - The Rheology Gap: A Component-Level Benchmark for VR-to-Reality Motor Skill Transfer under Linear Haptic Simulation
AU  - Zhiping Liu
AU  - Lu An
PY  - 2026
JO  - IEEE Transactions on Visualization and Computer Graphics
DO  - 10.1109/tvcg.2026.3745621
UR  - https://doi.org/10.1109/tvcg.2026.3745621
ER  - 

APA

Liu, Z., & An, L. (2026). The Rheology Gap: A Component-Level Benchmark for VR-to-Reality Motor Skill Transfer under Linear Haptic Simulation. IEEE Transactions on Visualization and Computer Graphics. https://doi.org/10.1109/tvcg.2026.3745621

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