Energy-Efficient SIM-Assisted Communications: How Many Layers Do We Need?

Enyu Shi, Jiayi Zhang, Jiancheng An, Marco Di Renzo, Bo Ai, Chau Yuen

Open source

DOI
10.1109/twc.2025.3612266
Published
2026
Container
IEEE Transactions on Wireless Communications
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Open access
unknown

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BibTeX

@article{allodium:10.1109/twc.2025.3612266,
  title = {Energy-Efficient SIM-Assisted Communications: How Many Layers Do We Need?},
  author = {Enyu Shi and Jiayi Zhang and Jiancheng An and Marco Di Renzo and Bo Ai and Chau Yuen},
  year = {2026},
  journal = {IEEE Transactions on Wireless Communications},
  doi = {10.1109/twc.2025.3612266},
  url = {https://doi.org/10.1109/twc.2025.3612266}
}

RIS

TY  - JOUR
TI  - Energy-Efficient SIM-Assisted Communications: How Many Layers Do We Need?
AU  - Enyu Shi
AU  - Jiayi Zhang
AU  - Jiancheng An
AU  - Marco Di Renzo
AU  - Bo Ai
AU  - Chau Yuen
PY  - 2026
JO  - IEEE Transactions on Wireless Communications
DO  - 10.1109/twc.2025.3612266
UR  - https://doi.org/10.1109/twc.2025.3612266
ER  - 

APA

Shi, E., Zhang, J., An, J., Renzo, M. D., Ai, B., & Yuen, C. (2026). Energy-Efficient SIM-Assisted Communications: How Many Layers Do We Need?. IEEE Transactions on Wireless Communications. https://doi.org/10.1109/twc.2025.3612266

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