Molecular mechanisms of enhanced wound healing by copper oxide-impregnated dressings.

Borkow G, Gabbay J, Dardik R, Eidelman AI, Lavie Y, Grunfeld Y, Ikher S, Huszar M, Zatcoff RC, Marikovsky M

Open source

DOI
10.1111/j.1524-475x.2010.00573.x
Published
2010 Mar-Apr
Container
Wound repair and regeneration : official publication of the Wound Healing Society [and] the European Tissue Repair Society
Publisher
Not recorded
Open access
unknown

Credibility signals

limited evidence Score 43/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.1111/j.1524-475x.2010.00573.x,
  title = {Molecular mechanisms of enhanced wound healing by copper oxide-impregnated dressings.},
  author = {Borkow G and Gabbay J and Dardik R and Eidelman AI and Lavie Y and Grunfeld Y and Ikher S and Huszar M and Zatcoff RC and Marikovsky M},
  year = {2010},
  journal = {Wound repair and regeneration : official publication of the Wound Healing Society [and] the European Tissue Repair Society},
  doi = {10.1111/j.1524-475x.2010.00573.x},
  url = {https://doi.org/10.1111/j.1524-475x.2010.00573.x}
}

RIS

TY  - JOUR
TI  - Molecular mechanisms of enhanced wound healing by copper oxide-impregnated dressings.
AU  - Borkow G
AU  - Gabbay J
AU  - Dardik R
AU  - Eidelman AI
AU  - Lavie Y
AU  - Grunfeld Y
AU  - Ikher S
AU  - Huszar M
AU  - Zatcoff RC
AU  - Marikovsky M
PY  - 2010
JO  - Wound repair and regeneration : official publication of the Wound Healing Society [and] the European Tissue Repair Society
DO  - 10.1111/j.1524-475x.2010.00573.x
UR  - https://doi.org/10.1111/j.1524-475x.2010.00573.x
ER  - 

APA

G, B., J, G., R, D., AI, E., Y, L., Y, G., S, I., M, H., RC, Z., & M, M. (2010). Molecular mechanisms of enhanced wound healing by copper oxide-impregnated dressings.. Wound repair and regeneration : official publication of the Wound Healing Society [and] the European Tissue Repair Society. https://doi.org/10.1111/j.1524-475x.2010.00573.x

Source records