Flash electropolishing for TEM: Reducing FIB-induced defects in tungsten with protocols for new materials.

Lin YR, Zhong W, Calzada SE, Lach TG, Nuckols LJ, Parish CM, Zinkle SJ, Burke MG

DOI: 10.1111/jmi.70122
Published: 2026 Aug
Container: Journal of microscopy
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1111/jmi.70122,
  title = {Flash electropolishing for TEM: Reducing FIB-induced defects in tungsten with protocols for new materials.},
  author = {Lin YR and Zhong W and Calzada SE and Lach TG and Nuckols LJ and Parish CM and Zinkle SJ and Burke MG},
  year = {2026},
  journal = {Journal of microscopy},
  doi = {10.1111/jmi.70122},
  url = {https://doi.org/10.1111/jmi.70122}
}

RIS

TY  - JOUR
TI  - Flash electropolishing for TEM: Reducing FIB-induced defects in tungsten with protocols for new materials.
AU  - Lin YR
AU  - Zhong W
AU  - Calzada SE
AU  - Lach TG
AU  - Nuckols LJ
AU  - Parish CM
AU  - Zinkle SJ
AU  - Burke MG
PY  - 2026
JO  - Journal of microscopy
DO  - 10.1111/jmi.70122
UR  - https://doi.org/10.1111/jmi.70122
ER  -

APA

YR, L., W, Z., SE, C., TG, L., LJ, N., CM, P., SJ, Z., & MG, B. (2026). Flash electropolishing for TEM: Reducing FIB-induced defects in tungsten with protocols for new materials.. Journal of microscopy. https://doi.org/10.1111/jmi.70122

Source records

pubmed · retrieved 2026-09-25T13:19:42.260Z