Assembly of mobile 5G transceiver based on photonic motherboard

Bradley W. Snyder, Zerihun G. Tegegne, Nienke Nijenhuis, Tianwen Qian, David de Felipe, Simon Nellen, Milan Deumer, Y. Durvasa Gupta, Moritz Baier, Björn Globisch, Norbert Keil, Joost Van Kerkhof

Open source

DOI
10.1117/12.2616674
Published
2022-03-05
Container
Optical Interconnects XXII
Publisher
SPIE
Open access
unknown

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BibTeX

@article{allodium:10.1117/12.2616674,
  title = {Assembly of mobile 5G transceiver based on photonic motherboard},
  author = {Bradley W. Snyder and Zerihun G. Tegegne and Nienke Nijenhuis and Tianwen Qian and David de Felipe and Simon Nellen and Milan Deumer and Y. Durvasa Gupta and Moritz Baier and Björn Globisch and Norbert Keil and Joost Van Kerkhof},
  year = {2022},
  journal = {Optical Interconnects XXII},
  doi = {10.1117/12.2616674},
  url = {https://doi.org/10.1117/12.2616674}
}

RIS

TY  - JOUR
TI  - Assembly of mobile 5G transceiver based on photonic motherboard
AU  - Bradley W. Snyder
AU  - Zerihun G. Tegegne
AU  - Nienke Nijenhuis
AU  - Tianwen Qian
AU  - David de Felipe
AU  - Simon Nellen
AU  - Milan Deumer
AU  - Y. Durvasa Gupta
AU  - Moritz Baier
AU  - Björn Globisch
AU  - Norbert Keil
AU  - Joost Van Kerkhof
PY  - 2022
JO  - Optical Interconnects XXII
DO  - 10.1117/12.2616674
UR  - https://doi.org/10.1117/12.2616674
ER  - 

APA

Snyder, B. W., Tegegne, Z. G., Nijenhuis, N., Qian, T., Felipe, D. D., Nellen, S., Deumer, M., Gupta, Y. D., Baier, M., Globisch, B., Keil, N., & Kerkhof, J. V. (2022). Assembly of mobile 5G transceiver based on photonic motherboard. Optical Interconnects XXII. https://doi.org/10.1117/12.2616674

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