Deployable electronics with enhanced fatigue resistance for crumpling and tension
- DOI
- 10.1126/sciadv.adr3654
- Published
- 2025-01-24
- Container
- Science Advances
- Publisher
- American Association for the Advancement of Science (AAAS)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1126/sciadv.adr3654,
title = {Deployable electronics with enhanced fatigue resistance for crumpling and tension},
author = {Insic Hong and Yeonwook Roh and Junggwang Cho and Seunggon Lee and Minji Kang and Damin Choi and Dohyeon Gong and Hyeongi An and Daseul Lim and Dongwook Shin and Jieun Park and Changhwan Kim and Taewi Kim and Minho Kim and Sunghoon Im and Jingoo Lee and Gunhee Lee and Uikyum Kim and Seung Hwan Ko and Je-Sung Koh and Daeshik Kang and Seungyong Han},
year = {2025},
journal = {Science Advances},
doi = {10.1126/sciadv.adr3654},
url = {https://doi.org/10.1126/sciadv.adr3654}
}RIS
TY - JOUR TI - Deployable electronics with enhanced fatigue resistance for crumpling and tension AU - Insic Hong AU - Yeonwook Roh AU - Junggwang Cho AU - Seunggon Lee AU - Minji Kang AU - Damin Choi AU - Dohyeon Gong AU - Hyeongi An AU - Daseul Lim AU - Dongwook Shin AU - Jieun Park AU - Changhwan Kim AU - Taewi Kim AU - Minho Kim AU - Sunghoon Im AU - Jingoo Lee AU - Gunhee Lee AU - Uikyum Kim AU - Seung Hwan Ko AU - Je-Sung Koh AU - Daeshik Kang AU - Seungyong Han PY - 2025 JO - Science Advances DO - 10.1126/sciadv.adr3654 UR - https://doi.org/10.1126/sciadv.adr3654 ER -
APA
Hong, I., Roh, Y., Cho, J., Lee, S., Kang, M., Choi, D., Gong, D., An, H., Lim, D., Shin, D., Park, J., Kim, C., Kim, T., Kim, M., Im, S., Lee, J., Lee, G., Kim, U., Ko, S. H., Koh, J., Kang, D., & Han, S. (2025). Deployable electronics with enhanced fatigue resistance for crumpling and tension. Science Advances. https://doi.org/10.1126/sciadv.adr3654
Source records
- crossref · retrieved 2026-09-27T14:32:14.637Z