Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects
- DOI
- 10.1149/2162-8777/ae170a
- Published
- 2025-11-01
- Container
- ECS Journal of Solid State Science and Technology
- Publisher
- The Electrochemical Society
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1149/2162-8777/ae170a,
title = {Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects},
author = {Junghyun Park and Ignace Agbadan and Monsuru Dauda and Mustapha Bello and John Hendershot and Soundarzo Tasnim and Omotolani Oduyebo and Sunggook Park and Anthony Engler and Jaimal Williamson and Varughese Mathew and Cigdem Atalay-Oral and John Flake},
year = {2025},
journal = {ECS Journal of Solid State Science and Technology},
doi = {10.1149/2162-8777/ae170a},
url = {https://doi.org/10.1149/2162-8777/ae170a}
}RIS
TY - JOUR TI - Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects AU - Junghyun Park AU - Ignace Agbadan AU - Monsuru Dauda AU - Mustapha Bello AU - John Hendershot AU - Soundarzo Tasnim AU - Omotolani Oduyebo AU - Sunggook Park AU - Anthony Engler AU - Jaimal Williamson AU - Varughese Mathew AU - Cigdem Atalay-Oral AU - John Flake PY - 2025 JO - ECS Journal of Solid State Science and Technology DO - 10.1149/2162-8777/ae170a UR - https://doi.org/10.1149/2162-8777/ae170a ER -
APA
Park, J., Agbadan, I., Dauda, M., Bello, M., Hendershot, J., Tasnim, S., Oduyebo, O., Park, S., Engler, A., Williamson, J., Mathew, V., Atalay-Oral, C., & Flake, J. (2025). Copper-Epoxy Interface Engineering for High-Frequency Chip-to-Chip Interconnects. ECS Journal of Solid State Science and Technology. https://doi.org/10.1149/2162-8777/ae170a
Source records
- crossref · retrieved 2026-09-26T13:30:06.419Z