Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

Masaru Ishizuka, Tomoyuki Hatakeyama, Yuichi Funawatashi, katsuhiro Koizumi

Open source

DOI: 10.1155/2011/823654
Published: 2011
Container: Active and Passive Electronic Components
Publisher: Hindawi Limited
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1155/2011/823654,
  title = {Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate},
  author = {Masaru Ishizuka and Tomoyuki Hatakeyama and Yuichi Funawatashi and katsuhiro Koizumi},
  year = {2011},
  journal = {Active and Passive Electronic Components},
  doi = {10.1155/2011/823654},
  url = {https://doi.org/10.1155/2011/823654}
}

RIS

TY  - JOUR
TI  - Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate
AU  - Masaru Ishizuka
AU  - Tomoyuki Hatakeyama
AU  - Yuichi Funawatashi
AU  - katsuhiro Koizumi
PY  - 2011
JO  - Active and Passive Electronic Components
DO  - 10.1155/2011/823654
UR  - https://doi.org/10.1155/2011/823654
ER  -

APA

Ishizuka, M., Hatakeyama, T., Funawatashi, Y., & Koizumi, K. (2011). Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate. Active and Passive Electronic Components. https://doi.org/10.1155/2011/823654

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crossref · retrieved 2026-09-26T06:45:23.252Z