Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials

Pinki Kumari, Kuldeep Singh, Anuj Singal

Open source

DOI: 10.11591/ijece.v10i1.pp494-499
Published: 2020-02-01
Container: International Journal of Electrical and Computer Engineering (IJECE)
Publisher: Institute of Advanced Engineering and Science
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.11591/ijece.v10i1.pp494-499,
  title = {Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials},
  author = {Pinki Kumari and Kuldeep Singh and Anuj Singal},
  year = {2020},
  journal = {International Journal of Electrical and Computer Engineering (IJECE)},
  doi = {10.11591/ijece.v10i1.pp494-499},
  url = {https://doi.org/10.11591/ijece.v10i1.pp494-499}
}

RIS

TY  - JOUR
TI  - Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials
AU  - Pinki Kumari
AU  - Kuldeep Singh
AU  - Anuj Singal
PY  - 2020
JO  - International Journal of Electrical and Computer Engineering (IJECE)
DO  - 10.11591/ijece.v10i1.pp494-499
UR  - https://doi.org/10.11591/ijece.v10i1.pp494-499
ER  -

APA

Kumari, P., Singh, K., & Singal, A. (2020). Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials. International Journal of Electrical and Computer Engineering (IJECE). https://doi.org/10.11591/ijece.v10i1.pp494-499

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crossref · retrieved 2026-09-26T18:19:43.056Z