A systematic review of structural equation modeling in augmented reality applications

Vinh The Nguyen, Chuyen Thi Hong Nguyen

Open source

DOI: 10.11591/ijeecs.v28.i1.pp328-338
Published: 2022-10-01
Container: Indonesian Journal of Electrical Engineering and Computer Science
Publisher: Institute of Advanced Engineering and Science
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.11591/ijeecs.v28.i1.pp328-338,
  title = {A systematic review of structural equation modeling in  augmented reality applications},
  author = {Vinh The Nguyen and Chuyen Thi Hong Nguyen},
  year = {2022},
  journal = {Indonesian Journal of Electrical Engineering and Computer Science},
  doi = {10.11591/ijeecs.v28.i1.pp328-338},
  url = {https://doi.org/10.11591/ijeecs.v28.i1.pp328-338}
}

RIS

TY  - JOUR
TI  - A systematic review of structural equation modeling in  augmented reality applications
AU  - Vinh The Nguyen
AU  - Chuyen Thi Hong Nguyen
PY  - 2022
JO  - Indonesian Journal of Electrical Engineering and Computer Science
DO  - 10.11591/ijeecs.v28.i1.pp328-338
UR  - https://doi.org/10.11591/ijeecs.v28.i1.pp328-338
ER  -

APA

Nguyen, V. T., & Nguyen, C. T. H. (2022). A systematic review of structural equation modeling in augmented reality applications. Indonesian Journal of Electrical Engineering and Computer Science. https://doi.org/10.11591/ijeecs.v28.i1.pp328-338

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crossref · retrieved 2026-09-25T15:19:42.611Z