Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations
- DOI
- 10.1166/jctn.2015.3710
- Published
- 2015
- Container
- Journal of computational and theoretical nanoscience
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.1166/jctn.2015.3710,
title = {Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations},
author = {Nuo Yang and Tengfei Luo and Keivan Esfarjani and Asegun Henry and Zhiting Tian and Junichiro Shiomi and Yann Chalopin and Baowen Li and Gang Chen},
year = {2015},
journal = {Journal of computational and theoretical nanoscience},
doi = {10.1166/jctn.2015.3710},
url = {https://doi.org/10.1166/jctn.2015.3710}
}RIS
TY - JOUR TI - Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations AU - Nuo Yang AU - Tengfei Luo AU - Keivan Esfarjani AU - Asegun Henry AU - Zhiting Tian AU - Junichiro Shiomi AU - Yann Chalopin AU - Baowen Li AU - Gang Chen PY - 2015 JO - Journal of computational and theoretical nanoscience DO - 10.1166/jctn.2015.3710 UR - https://doi.org/10.1166/jctn.2015.3710 ER -
APA
Yang, N., Luo, T., Esfarjani, K., Henry, A., Tian, Z., Shiomi, J., Chalopin, Y., Li, B., & Chen, G. (2015). Thermal Interface Conductance Between Aluminum and Silicon by Molecular Dynamics Simulations. Journal of computational and theoretical nanoscience. https://doi.org/10.1166/jctn.2015.3710
Source records
- hal · retrieved 2026-09-26T00:29:10.460Z