Chemical-Mechanical Planarization Aided Dimple Etching for Self Alignment

Moonki Jeong, Sungha Choi, Yongchang Guo, Jaehong Park, Haedo Jeong

Open source

DOI: 10.1166/jnn.2012.5615
Published: 2012-04-01
Container: Journal of Nanoscience and Nanotechnology
Publisher: American Scientific Publishers
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1166/jnn.2012.5615,
  title = {Chemical-Mechanical Planarization Aided Dimple Etching for Self Alignment},
  author = {Moonki Jeong and Sungha Choi and Yongchang Guo and Jaehong Park and Haedo Jeong},
  year = {2012},
  journal = {Journal of Nanoscience and Nanotechnology},
  doi = {10.1166/jnn.2012.5615},
  url = {https://doi.org/10.1166/jnn.2012.5615}
}

RIS

TY  - JOUR
TI  - Chemical-Mechanical Planarization Aided Dimple Etching for Self Alignment
AU  - Moonki Jeong
AU  - Sungha Choi
AU  - Yongchang Guo
AU  - Jaehong Park
AU  - Haedo Jeong
PY  - 2012
JO  - Journal of Nanoscience and Nanotechnology
DO  - 10.1166/jnn.2012.5615
UR  - https://doi.org/10.1166/jnn.2012.5615
ER  -

APA

Jeong, M., Choi, S., Guo, Y., Park, J., & Jeong, H. (2012). Chemical-Mechanical Planarization Aided Dimple Etching for Self Alignment. Journal of Nanoscience and Nanotechnology. https://doi.org/10.1166/jnn.2012.5615

Source records

crossref · retrieved 2026-09-25T20:36:41.572Z