Laponite-Mediated Copper Metallization by Palladium Intercalation.

Kim JS, Suh D

DOI: 10.1166/jnn.2021.19427
Published: 2021 Aug 1
Container: Journal of nanoscience and nanotechnology
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1166/jnn.2021.19427,
  title = {Laponite-Mediated Copper Metallization by Palladium Intercalation.},
  author = {Kim JS and Suh D},
  year = {2021},
  journal = {Journal of nanoscience and nanotechnology},
  doi = {10.1166/jnn.2021.19427},
  url = {https://doi.org/10.1166/jnn.2021.19427}
}

RIS

TY  - JOUR
TI  - Laponite-Mediated Copper Metallization by Palladium Intercalation.
AU  - Kim JS
AU  - Suh D
PY  - 2021
JO  - Journal of nanoscience and nanotechnology
DO  - 10.1166/jnn.2021.19427
UR  - https://doi.org/10.1166/jnn.2021.19427
ER  -

APA

JS, K., & D, S. (2021). Laponite-Mediated Copper Metallization by Palladium Intercalation.. Journal of nanoscience and nanotechnology. https://doi.org/10.1166/jnn.2021.19427

Source records

pubmed · retrieved 2026-11-10T11:44:36.196Z