Process envelope and void defect analysis in FSW of AA2024, AA5052 and AA7075 aluminium alloys.

Liu X, Gerlich AP, Mendez PF.

DOI: 10.1177/13621718251413024
Published: 2026-01-09
Container: Sci Technol Weld Join
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1177/13621718251413024,
  title = {Process envelope and void defect analysis in FSW of AA2024, AA5052 and AA7075 aluminium alloys.},
  author = {Liu X and  Gerlich AP and  Mendez PF.},
  year = {2026},
  journal = {Sci Technol Weld Join},
  doi = {10.1177/13621718251413024},
  url = {https://doi.org/10.1177/13621718251413024}
}

RIS

TY  - JOUR
TI  - Process envelope and void defect analysis in FSW of AA2024, AA5052 and AA7075 aluminium alloys.
AU  - Liu X
AU  -  Gerlich AP
AU  -  Mendez PF.
PY  - 2026
JO  - Sci Technol Weld Join
DO  - 10.1177/13621718251413024
UR  - https://doi.org/10.1177/13621718251413024
ER  -

APA

X, L., AP, G., & PF., M. (2026). Process envelope and void defect analysis in FSW of AA2024, AA5052 and AA7075 aluminium alloys.. Sci Technol Weld Join. https://doi.org/10.1177/13621718251413024

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europe-pmc · retrieved 2026-09-26T05:46:07.439Z