A critical review of constitutive models for solders in electronic packaging

Gang Chen, Xiaochen Zhao, Hao Wu

Open source

DOI: 10.1177/1687814017714976
Published: 8
Container: Advances in Mechanical Engineering
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1177/1687814017714976,
  title = {A critical review of constitutive models for solders in electronic packaging},
  author = {Gang Chen and Xiaochen Zhao and Hao Wu},
  year = {2017},
  journal = {Advances in Mechanical Engineering},
  doi = {10.1177/1687814017714976},
  url = {https://doi.org/10.1177/1687814017714976}
}

RIS

TY  - JOUR
TI  - A critical review of constitutive models for solders in electronic packaging
AU  - Gang Chen
AU  - Xiaochen Zhao
AU  - Hao Wu
PY  - 2017
JO  - Advances in Mechanical Engineering
DO  - 10.1177/1687814017714976
UR  - https://doi.org/10.1177/1687814017714976
ER  -

APA

Chen, G., Zhao, X., & Wu, H. (2017). A critical review of constitutive models for solders in electronic packaging. Advances in Mechanical Engineering. https://doi.org/10.1177/1687814017714976

Source records

doaj · retrieved 2026-09-25T11:12:04.235Z