Copper-selective electrochemical filling of macropore arrays for through-silicon via applications.

Defforge T, Billoué J, Diatta M, Tran-Van F, Gautier G

DOI: 10.1186/1556-276x-7-375
Published: 2012 Jul 9
Container: Nanoscale research letters
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1186/1556-276x-7-375,
  title = {Copper-selective electrochemical filling of macropore arrays for through-silicon via applications.},
  author = {Defforge T and Billoué J and Diatta M and Tran-Van F and Gautier G},
  year = {2012},
  journal = {Nanoscale research letters},
  doi = {10.1186/1556-276x-7-375},
  url = {https://doi.org/10.1186/1556-276x-7-375}
}

RIS

TY  - JOUR
TI  - Copper-selective electrochemical filling of macropore arrays for through-silicon via applications.
AU  - Defforge T
AU  - Billoué J
AU  - Diatta M
AU  - Tran-Van F
AU  - Gautier G
PY  - 2012
JO  - Nanoscale research letters
DO  - 10.1186/1556-276x-7-375
UR  - https://doi.org/10.1186/1556-276x-7-375
ER  -

APA

T, D., J, B., M, D., F, T., & G, G. (2012). Copper-selective electrochemical filling of macropore arrays for through-silicon via applications.. Nanoscale research letters. https://doi.org/10.1186/1556-276x-7-375

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pubmed · retrieved 2026-11-10T12:42:00.094Z