Development of an innovative low-temperature PEALD process for stress-compensated TiO2 and SiO2 multilayer anti-reflective coatings

Duy Thanh Cu, Kuan-Yu Ko, Wen-Hao Cho, Chao-Te Lee, Meng-Chi Li, Chien-Cheng Kuo

Open source

DOI
10.1186/s11671-025-04238-2
Published
2025-03-24
Container
Discover Nano
Publisher
Springer Science and Business Media LLC
Open access
unknown

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BibTeX

@article{allodium:10.1186/s11671-025-04238-2,
  title = {Development of an innovative low-temperature PEALD process for stress-compensated TiO2 and SiO2 multilayer anti-reflective coatings},
  author = {Duy Thanh Cu and Kuan-Yu Ko and Wen-Hao Cho and Chao-Te Lee and Meng-Chi Li and Chien-Cheng Kuo},
  year = {2025},
  journal = {Discover Nano},
  doi = {10.1186/s11671-025-04238-2},
  url = {https://doi.org/10.1186/s11671-025-04238-2}
}

RIS

TY  - JOUR
TI  - Development of an innovative low-temperature PEALD process for stress-compensated TiO2 and SiO2 multilayer anti-reflective coatings
AU  - Duy Thanh Cu
AU  - Kuan-Yu Ko
AU  - Wen-Hao Cho
AU  - Chao-Te Lee
AU  - Meng-Chi Li
AU  - Chien-Cheng Kuo
PY  - 2025
JO  - Discover Nano
DO  - 10.1186/s11671-025-04238-2
UR  - https://doi.org/10.1186/s11671-025-04238-2
ER  - 

APA

Cu, D. T., Ko, K., Cho, W., Lee, C., Li, M., & Kuo, C. (2025). Development of an innovative low-temperature PEALD process for stress-compensated TiO2 and SiO2 multilayer anti-reflective coatings. Discover Nano. https://doi.org/10.1186/s11671-025-04238-2

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